Scaling limitations of today’s manufacturing technology for optical transceivers: Even with the recent rapid growth of the amount of devices that can be monolithically integrated on a photonic integrated circuit (PIC), manufacturing such an optical transceiver still requires a large amount of sequential assembly steps. Indeed an optical transceiver consist of one or more Photonic Integrated Circuits, one or more high-speed Electronic Integrated Circuits, which need to be assembled together. In addition, fiber attachment needs to be done. In Caladan, the integration of Photonics and Electronics will be done fully at the wafer level through the use of micro transfer printing. This significantly simplifies the assembly flow, reducing overall manufacturing costs.